As the electronics industry continues to evolve toward miniaturization, high integration, and enhanced performance, the demand for advanced conductive materials has grown rapidly. Copper powder has become one of the key materials widely used in the manufacturing of multi-layer ceramic capacitors (MLCCs), particularly for terminal electrodes and inner electrode applications. Compared with precious metals, copper offers excellent electrical conductivity, stable chemical properties, and significant cost advantages, making it an ideal choice for modern electronic component manufacturing.
Alfa Chemistry provides two major product series of copper powder: spherical copper powder and flake copper powder. Both product lines are developed to deliver excellent conductivity, stable processing performance, and reliable application properties for MLCC electrode production.
Spherical copper powder is designed for applications requiring excellent flowability, uniform particle distribution, and stable sintering performance. With carefully controlled production processes, the powder demonstrates outstanding physical and chemical characteristics.

These characteristics contribute to improved paste formulation stability, enhanced printing performance, and reliable electrical conductivity in MLCC manufacturing processes. The spherical structure also helps reduce agglomeration and improves packing density during electrode fabrication.
Flake copper powder is specifically designed for applications requiring high electrical conductivity and stable processing performance. This product helps improve electrical contact performance during electrode fabrication and supports the formation of high-quality conductive layers in MLCC manufacturing processes.

With its optimized flake structure and reliable material consistency, flake copper powder is widely used in the manufacturing of terminal and inner electrodes for MLCCs. The product helps improve electrode uniformity, supports stable electrical performance, and contributes to reliable product quality during large-scale electronic component manufacturing.
In addition to standard products, Alfa Chemistry can also provide customized copper powder solutions based on specific particle size, morphology, and application requirements for MLCC manufacturing.
Spherical Copper Powder
Flake Copper Powder
| Catalog Number | Average Particle Size (μm) | SSA (m2/g) | PSD (μm) | Tap Density(g/cm3) | ||
| D10 | D50 | D90 | ||||
| ACSEM-EP-0045 | 0.15 | 3.80-4.00 | 0.10-0.45 | 0.46-0.70 | 0.71-1.40 | ≥1.80 |
| ACSEM-EP-0046 | 0.20 | 2.40-3.50 | 0.20-0.50 | 0.51-0.80 | 0.81-1.50 | ≥2.20 |
| ACSEM-EP-0047 | 0.30 | 1.69-2.69 | 0.30-0.70 | 0.71-1.20 | 1.21-2.80 | ≥2.60 |
| ACSEM-EP-0048 | 0.50 | 1.10-1.70 | 0.40-0.70 | 0.71-1.45 | 1.46-3.00 | ≥3.00 |
| ACSEM-EP-0049 | 1.00 | 0.60-1.00 | 0.80-1.80 | 1.81-2.80 | 2.81-5.20 | ≥3.50 |
| ACSEM-EP-0050 | 2.50 | 0.40-0.60 | 1.20-1.60 | 2.10-2.60 | 3.60-4.50 | ≥3.50 |
| ACSEM-EP-0051 | 3.50 | 0.20-0.40 | 1.75-2.35 | 3.00-3.70 | 4.20-6.20 | ≥4.00 |
| Catalog Number | SSA (m2/g) | PSD (μm) | Tap Density(g/cm3) | ||
| D10 | D50 | D90 | |||
| ACSEM-EP-0052 | 1.00-1.50 | 1.00-2.00 | 2.01-3.50 | 4.00-6.00 | ≥2.50 |
| ACSEM-EP-0053 | 0.80-1.40 | 1.50-2.50 | 2.60-4.50 | 4.60-6.50 | ≥3.00 |
| ACSEM-EP-0054 | 0.70-1.30 | 3.00-4.50 | 4.60-6.50 | 6.60-10.50 | ≥3.50 |
Through continuous innovation and rigorous quality standards, Alfa Chemistry is able to provide copper powder products with excellent conductivity, controlled morphology, and reliable batch-to-batch consistency. Our products are designed to support the evolving requirements of modern electronic industries and help customers improve manufacturing efficiency and product performance. If you are interested in our copper powder or would like to learn more about our customized solutions, please feel free to contact us. We look forward to supporting your electronic material and manufacturing needs.
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