Semiconductor assembly materials are the types of materials used to control heat, insulation, bonding and packaging during the assembly process of electronic packaging. These materials range from adhesives to sealants. They make our mobile devices smarter, more reliable, faster network connections.
Alfa Chemistry provides our customers with semiconductor assembly materials solutions. We develop and provide advanced materials for the packaging and assembly of semiconductors and electronic products. Our adhesives are designed to enhance the assembly process and improve reliability. Our sealants can provide environmental protection, reduce warpage, show excellent fluidity, and have good adhesion to a variety of substrates.
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At the Heart of Heterogeneous Integration
Semiconductor assembly materials lay the foundation for today's heterogeneous integration technology by providing multiple functions.
They provide a permanent bonding process for 2.5D and 3D integrated packaging architectures and provide interconnection capabilities and protection for integrating MEMS, sensors, and ICs into a system-in-package configuration.
These materials must be designed to:
- Improve equipment reliability
- Improve thermal management
- Prevent mechanical and thermal stress
- Prevent high-frequency signal transmission loss
What Can We Offer?
Our materials are developed according to the latest requirements and are proven in production. The new formula is developed rapidly and has been tested according to the most stringent requirements of the customer.
Our semiconductor assembly materials include, but are not limited to, the following:
- Thermal interface material
Thermally conductive silicone is designed to deal with the heat dissipation problems of today's advanced electronic equipment.
- Permanently bonded dielectric
Photopatternable dielectrics and non-photo patternable adhesives make chip-to-wafer and wafer-to-wafer stacking possible, thereby achieving heterogeneous integration.
The silicone-based lid sealant product portfolio is designed to cope with the high functionality of today's advanced packaging processes and provide the performance required for today's high-performance computing, mobile, and automotive electronics applications.
Even at the high reflow temperatures required for lead-free solder processing or strict thermal stress reliability testing conditions, silicone dies encapsulants can maintain reliable performance.
Common chip attaches adhesives are suitable for common chip applications. When the chip design must provide reliable performance under extreme temperature, high humidity, or pressure environment, please ask us for extraordinary solutions.
Benefits of Working with Us
The core of our business is a deep partnership and an in-depth understanding of customer needs. Choose Alfa Chemistry as your material solution partner to:
- Get complete solutions, not just materials
- Benefit from development ahead of industry trends
- Utilize years of expertise and technology in electronics and imaging
