As technology advances, the size of portable and handheld devices continues to decrease. These devices require smaller components, which in turn require thinner wafers. Achieving the correct wafer thinness before assembly is critical to semiconductor manufacturing. Wafer thinning is a semiconductor manufacturing process aimed at reducing the thickness of wafers, which can produce ultra-thin wafers for stacking and high-density packaging in compact electronic devices. You need an experienced company to achieve the required thickness without damaging the silicon wafer or compromising its strength.
Alfa Chemistry provides fast and reliable small batch services for the back or front thinning of various types of substrates.
No matter what type of wafer you need to thin, we have a solution for your project. Since time is of the essence, we have simplified the thinning process of semiconductor wafers, so you can enjoy the request time of the day with a 24-hour or 48-hour cycle.
Alfa Chemistry uses advanced technology to meet the needs of today's technology companies for extremely thin silicon wafers and dies for complex applications. We usually use four main methods to thin wafers:
This process is the most conventional thinning technology used today, and its accuracy and high thinning rate are very advantageous.
Chemical Mechanical Planarization (CMP)
This process flattens the wafer and removes surface irregularities. CMP is performed using a small particle abrasive chemical slurry and polishing pad. Although it tends to be less clean, it provides more planarization than mechanical grinding.
Wet etching uses liquid chemicals or etchants to remove material from the wafer. There are two methods of performing wet etching: isotropic (uniform in all directions) and anisotropic (uniform in the vertical direction).
Atmospheric Downstream Plasma Dry Chemical Etching (ADP DCE)
ADP DCE is the latest wafer thinning technology that uses plasma or etching gas to remove material. This method can produce very thin wafers with high yields.
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