Alfa Chemistry has many years of experience in depositing various metal films on substrates for PVD and CVD applications. We have advanced deposition techniques, including sputtered metals and electron beam evaporation of metals. In addition to silicon wafer substrates, Alfa Chemistry can also perform metal deposition on various substrates, including alumina, fused silica, silicon carbide and other materials. We provide metal films of various thicknesses with industry-leading uniformity and resistance uniformity. Customers can contact us for specific requirements.
Sputtered Metal Deposition
Alfa Chemistry's sputtering technology can deposit ultra-clean metal and dielectric films. The sputtering metal deposition process is carried out in our class 100 cleanroom.
E-Beam Evaporated Metal Deposition
Alfa Chemistry's most popular sputtered films include:
Titanium | Aluminum | Aluminum Copper |
Chrome | Aluminum Silicon | Copper |
Nickel | Tantalum | Tungsten |
Alfa Chemistry's metals available for E-beam evaporation include:
Chromium | Aluminum | Gold |
Indium Tin oxide | Platinum | Nickel |
Tin | Silver | Titanium |
Sputtered Metal Deposition
Thickness range | 100Å - 1.5µm depending on metal |
Thickness tolerance | +/- 10% |
Sides processed | One |
Gases | Nitrogen, Argon |
Wafer size | 2" - 12" |
E-Beam Evaporated Metal Deposition
Thickness range | Varies depending on metal |
Thickness tolerance | +/- 5% |
Sides processed | One |
Gases | Nitrogen, Argon |
Wafer size | 100 mm, 150 mm, 200 mm |
Wafer material | Silicon, Silicon on Insulator, Quartz |
Wafer thickness | Semi standard |
Within wafer uniformity | +/- 5% or better |
Wafer to wafer uniformity | +/- 5% or better |
If you do not find the product or would like to request a quote, please contact us.