
As advanced manufacturing industries continue to demand tighter dimensional tolerances and superior surface quality, polishing materials play an increasingly critical role in precision processing. Among various polishing media, alumina oxide slurry has become one of the most widely adopted solutions for grinding, lapping, and polishing applications due to its excellent balance of hardness, chemical stability, and controllable cutting performance.
Alfa Chemistry develops and manufactures high-performance alumina oxide slurries through strict particle size control and optimization of particle surface properties. During processing, our products maintain stable and uniform cutting performance, effectively improving material removal efficiency while reducing surface scratches and processing defects, thereby achieving excellent surface finish and processing consistency.
The main features of our product are as follows:
Manufactured from carefully selected high-purity alumina materials, the slurry minimizes the introduction of impurities and contamination during polishing, making it suitable for high-precision processing environments.
The slurry provides strong and efficient cutting capability, enabling rapid and stable material removal while maintaining excellent surface control. It helps improve polishing efficiency without sacrificing surface quality.
Carefully controlled particle size distribution ensures consistent abrasive action across the polishing surface. This helps improve processing uniformity, reduce scratches, and enhance overall polishing stability.
The slurry exhibits outstanding dispersion and suspension stability, effectively reducing particle agglomeration and sedimentation during storage and operation, thereby maintaining reliable polishing performance over time.
The slurry has excellent easy-to-clean performance, which can effectively reduce residues on the processed surface and improve overall production efficiency.
Alfa Chemistry offers alumina oxide slurries in a wide range of particle sizes and specifications to meet different processing requirements.
| Catalog Number | PH | Median Particle Size (um) | Solid Content (%) | Application Areas |
| ACSEM-CMP-0072 | 14.0 | 1.6-2.0 | 21.5 | Sapphire substrates, windows |
| ACSEM-CMP-0073 | 13.5 | 1.2-1.4 | 20.0 | Sapphire substrates |
| ACSEM-CMP-0074 | 13.5 | 0.6-0.8 | 21.0 | Sapphire windows / optics |
| ACSEM-CMP-0075 | 8.5 | 0.1-0.2 | 20.0 | Infrared / crystals / germanium wafers |
| ACSEM-CMP-0076 | 5-6/9-10 | 0.2 | 8.0 | Silicon carbide, gallium nitride |
| ACSEM-CMP-0077 | 5-6/9-10 | 0.3 | 8.0 | Silicon carbide, gallium nitride |
Alfa Chemistry is committed to providing customers with alumina oxide slurries featuring excellent particle uniformity, stable dispersion performance, and highly controllable polishing behavior to meet the increasingly stringent process requirements of advanced manufacturing industries. In addition to standard products, we also offer customized solutions, including particle size distribution adjustment, solid content optimization, and formulation development for different polishing applications. If you have specific processing requirements or custom project needs, please feel free to contact us.
If you do not find the product or would like to request a quote, please contact us.