As the requirements for surface finishing continue to increase in advanced materials industries such as semiconductors, polishing processes are placing greater emphasis on both efficiency and surface integrity. In this context, polishing slurries are expected not only to deliver high material removal rates but also to ensure excellent surface quality and consistent process stability. Among various polishing materials, cerium oxide slurry has become one of the most widely used solutions for precision applications, owing to its unique combination of chemical reactivity and mechanical polishing capability.
Manufactured using tightly controlled wet microfiltration technology, our cerium oxide slurry features highly uniform particle size distribution and excellent dispersion stability. Combined with advanced chemical polishing additives, the slurry delivers optimized rheological behavior, allowing for smoother fluid flow, improved abrasive interaction, and enhanced polishing efficiency. The result is a high-quality surface finish with reduced defect generation and excellent process reliability.
Product Features
The main features of our product are as follows:
01
- High Cutting Efficiency with Precision Polishing Performance
The slurry delivers strong material removal capability while still maintaining excellent polishing precision. Its balanced mechanical and chemical polishing action helps achieve smooth, uniform surfaces with reduced surface defects, making it suitable for high-precision finishing applications.
02
Carefully optimized abrasive characteristics help minimize scratching during the polishing process. This allows for cleaner surface finishes and improved surface integrity, particularly for delicate or high-value substrates.
03
- Uniform Particle Size Distribution
Manufactured under strict particle size control processes, the slurry exhibits highly consistent particle distribution. The uniformity of abrasive particles contributes to stable polishing behavior, improved surface quality, and reduced risk of large-particle defects.
04
The slurry is formulated with advanced dispersion technology to maintain high chemical and physical stability during storage and operation. This helps ensure reliable polishing performance and consistent processing results over time.
05
- Improved Suspension Performance
Enhanced rheological properties allow abrasive particles to remain evenly suspended within the slurry system. This reduces particle sedimentation, improves polishing uniformity, and supports more stable operation during extended processing cycles.
06
Designed for prolonged operational stability, the slurry maintains effective polishing performance over extended usage periods. Its resistance to aggregation and settling helps reduce material waste and improve overall process efficiency.
Product Specifications
Alfa Chemistry offers cerium oxide slurries in a variety of specifications to meet diverse polishing requirements.
| Catalog Number | Median Particle Size (um) | PH | Color | Solid Content (%) | Application Areas |
| ACSEM-CMP-0064 | 0.1-0.2 | 4.0 | White | 25% | Glass wafers, precision optics |
| ACSEM-CMP-0065 | 0.05-0.1 | 9.5 | White | 15% | Glass wafers |
| ACSEM-CMP-0066 | 0.2-0.4 | 11.5 | White | 30% | Precision optics |
| ACSEM-CMP-0067 | 0.1-0.3 | 12.4 | Red | 26% | Blue glass filters |
| ACSEM-CMP-0068 | 0.4-0.6 | 11.5 | White | 25% | Photomasks, wafers |
| ACSEM-CMP-0069 | 0.6-0.8 | 10.0 | White | 50% | Optical glass, glass wafers |
| ACSEM-CMP-0070 | 0.12 | 5-6/9-10 | Purple | 8% | Silicon carbide, gallium nitride |
| ACSEM-CMP-0071 | 0.10 | 5-6/9-10 | Purple | 8% | Silicon carbide, gallium nitride |
Choose Alfa Chemistry
Alfa Chemistry focuses on providing reliable and application-oriented polishing solutions for modern precision industries. Our cerium oxide slurry is developed through carefully controlled manufacturing processes to ensure consistent particle distribution, stable suspension behavior, and dependable polishing performance. By combining advanced formulation technology with flexible customization capabilities, we are able to support a wide range of substrate materials and processing requirements. If you have any needs, please feel free to contact us.
