Wafer dicing is the process by which the die is separated from the wafer to the following wafer processing material, which is an automated process to ensure accuracy. Alfa Chemistry develops creative cost effective solutions to challenging micromachining problems. We provide wafer dicing services on patterned and unpatterned substrates.
Depending on the material and thickness of the substrate, we use different methods and tools to cut the wafer. Alfa Chemistry has experience in many challenging situations and will determine the best method based on your specifications, budget and materials. Our service is limited to small batches.
If required, our dicing services include wafer inspection and die sorting. For other information, you can call or email us to discuss your wafer cutting needs.
Laser cutting method. Use translucent wavelength light to penetrate the surface of the substrate and cut from the inside to the outside. It may not be suitable for wafers with films or patterns that interfere with the laser.
Traditional blade dicing requires the wafer to be mounted on the adhesive film inside the metal frame. When the blade is cut into thin slices, water or other coolant is sprayed along the cutting line.
Dicing is another form of blade dicing. This method is better for certain applications because the process is very fast and adds minimal residual stress.
Laser Ablation Dicing
In contrast to dicing and blade dicing, laser scribing does not use a physical blade to scribe the substrate. Laser ablation cutting is the process of removing material with a highly concentrated laser.
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