When a wafer is cut from a crystal with a regular crystal structure, the surface is oriented in one of several opposite directions, called the orientation. This is also the growth plane of crystalline silicon. Orientation is important for the electronic properties of the wafer, and the structure and electronic properties of many single crystals are highly anisotropic. The orientations of silicon wafers are classified using the Miller index, including (100), (111) and (110). Cutting the wafer along the cleave allows the ordinary chip to divide billions of individual circuit components into many independent circuits.
Alfa Chemistry provides customers with accurate wafer orientation testing services to meet customer application requirements. Our test reports are professional and authoritative.
Our testing capabilities include, but are not limited to, the following:
|X-ray diffraction (XRD)||Only a limited number of crystal grains can be tested, and it is limited by the extinction law of the system.||No|
|Electron backscatter diffraction (EBSD)||Only an area of a few square centimeters can be tested.||Mechanical mirror polishing|
|Neutron diffraction (ND)||Only a limited number of crystal grains can be tested, and it is limited by the extinction law of the system.||No|
|Selected area electron diffraction (SAED)||Only a small area can be tested, and it is limited by the extinction law of the system.||Made into slices|
|Laue scanner (XRD)||It can scan large-size silicon wafers with grain distribution, and can test a large area of 15.6 x 15.6 cm2.||No|
The instrument platforms we have include, but are not limited to, following:
If you do not find the product or would like to request a quote, please contact us.