Orientation

When a wafer is cut from a crystal with a regular crystal structure, the surface is oriented in one of several opposite directions, called the orientation. This is also the growth plane of crystalline silicon. Orientation is important for the electronic properties of the wafer, and the structure and electronic properties of many single crystals are highly anisotropic. The orientations of silicon wafers are classified using the Miller index, including (100), (111) and (110). Cutting the wafer along the cleave allows the ordinary chip to divide billions of individual circuit components into many independent circuits.

Alfa Chemistry provides customers with accurate wafer orientation testing services to meet customer application requirements. Our test reports are professional and authoritative.

Crystal Orientation Detection Technology

Our testing capabilities include, but are not limited to, the following:

Detectable Samples Include:

• Wafer specification diameter: 150mm, 200mm, 300mm.
• Conductivity: P or N type.
• Material: Si, GaAs, Ge, SiC, InP.Surface: Cutting, grinding, etching, polishing and patterned.
• Flat/notch: All SEMI standard flat or notch.

Orientation Analysis Instrument Platforms

The instrument platforms we have include, but are not limited to, following:

• Malvern Panalytical X'Pert³ MRD XL
• Photonic Science Laue Crystal Orientation System
• AZtec EBSD system

Testing Standard

• ASTM F847-1994(1999) Standard Test Method for X-ray Measurement of Crystallographic Orientation of Reference Plane of Single Crystal Silicon Wafer
• GB/T 13388-2009 Crystallographic Orientation X-ray Test Method of Silicon Wafer Reference Plane

Reference

1. Lehmann T, et al. (2014). "Laue Scanner: A New Method for Determination of Grain Orientations and Grain Boundary Types of Multicrystalline Silicon on A Full Wafer Scale." Acta Materialia.69: 1-8.