Laser Marking

With the widespread adoption of CSP technology and the increasing demand for miniaturization, precise marking on the chip level is required. Chips are no longer fully encapsulated in plastic packages, so tracking and inventory control require that the mark indicating the chip type and its lot number must be created directly on the semiconductor.

Alfa Chemistry provides SEMI standard and customized laser marking services. SEMI standard marks include M12, M13 and T7 marks, which are usually used on all wafer substrates. Our service is limited to small batches.

Interested in learning more about the service? Please contact us now.

Alfa Chemistry's Marking Methods

Alfa Chemistry uses lasers for marking, which will not cause any residual damage to the wafer. Laser marking has many advantages, including durability, cleanliness, programmability and lower cost of consumables.

Alfa Chemistry's wafer laser marking can survive the most demanding processes for identification and traceability. We use a 193 nm laser and an image mask to apply codes like OCR, BC, T7 (ECC200) and 2D on the outer area of the wafer surface. This mark endures throughout the manufacturing cycle, enabling an optical reader to view the mark at each stage.

Alfa Chemistry's Wafer Laser Marking Capabilities

• Wafer diameter: 50 mm to 300 mm
• Marking position: Front or back of wafer font, 0.010 to 12
• Format: Alphanumeric and barcode
• Character height and width: As required
• Depth: Available for soft and hard laser marking
• Soft mark: 1-5 μm in depth
• Hard mark: 5 μm to 100 μm in depth
• Special mark: Company logo, etc.
• Alfa Chemistry provides an option for wafer cleaning after marking.
• Alfa Chemistry provides sacrificial protective films (Click "Custom Film Coating" to learn more), such as oxide and nitride, which can be used to protect the surface of the wafer from the debris generated in the laser marking process.