In today's precision manufacturing, producing ultra-smooth and defect-free surfaces is no longer just a goal—it is a basic requirement in industries such as semiconductors, optics, and advanced materials. Alfa Chemistry's fine polishing pad is specifically engineered to meet these increasingly stringent standards. Manufactured from a selection of premium base materials, the pad is produced through dozens of carefully controlled processes, including drying, coagulation, and precise microstructural stabilization, resulting in a highly refined structure with excellent performance for advanced polishing applications.
Product Advantages
01
- Superior Surface Finishing Performance
Our fine polishing pad is primarily used in the final stage of processing, where the requirements for surface quality are the most stringent. It is capable of delivering exceptional smoothness and high gloss finishes, significantly reducing surface roughness and micro-scratches. By ensuring uniform pressure distribution during operation, the pad enhances polishing consistency across the entire substrate. This is particularly important for applications such as optical components, semiconductor wafers, and precision ceramics, where even minor surface irregularities can impact overall performance.
02
- Process Stability and Efficiency
Beyond surface quality, process stability is a key consideration in industrial polishing. Our fine polishing pad is designed to provide reliable and repeatable performance over extended use. Its optimized pore structure facilitates efficient slurry transport and debris removal, preventing clogging and maintaining stable polishing conditions. This not only improves process efficiency but also reduces downtime and consumable replacement frequency, contributing to lower overall operational costs.
Typical Applications
Thanks to its carefully engineered properties, this high-quality polishing pad is suitable for a wide range of applications.
01
In semiconductor manufacturing, it plays a crucial role in chemical mechanical polishing (CMP), particularly in the final polishing stages of silicon wafers. It is extensively applied in the planarization of dielectric layers such as silicon dioxide, as well as metal layers including copper and tungsten, helping to achieve excellent global and local uniformity while minimizing defects such as scratches and dishing.
02
In addition, the pad is well-suited for polishing compound semiconductor substrates, including gallium arsenide (GaAs), indium phosphide (InP), silicon carbide (SiC), and gallium nitride (GaN), where surface integrity and defect control are critical for device performance. Its finely tuned structure supports stable slurry distribution and consistent contact pressure, enabling precise material removal and ultra-low surface roughness.
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Beyond semiconductor applications, the fine polishing pad is also ideal for high-precision polishing of optical glass, sapphire substrates, quartz, and advanced ceramics.
Product Specifications
Our product specifications are listed below. You can select the most suitable pad according to your specific requirements.
| Catalog Number | Thickness (mm) | Density (g/cm3) | Compression Ratio (%) | Hardness (LX-A) |
| ACSEM-CMP-0101 | 0.81 | 0.34 | 7.2 | 60 |
| ACSEM-CMP-0102 | 0.81 | 0.60 | 5.0 | 76 |
| ACSEM-CMP-0103 | 0.95 | 0.37 | 4.5 | 67 |
| ACSEM-CMP-0104 | 1.00 | 0.46 | 4.1 | 64 |
| ACSEM-CMP-0105 | 1.50 | 0.35 | 3.3 | 58 |
| ACSEM-CMP-0106 | 1.50 | 0.38 | 9.3 | 68 |
| ACSEM-CMP-0107 | 1.50 | 0.50 | 4.4 | 55 |
| ACSEM-CMP-0108 | 1.50 | 0.50 | 4.2 | 60 |
| ACSEM-CMP-0109 | 1.50 | 0.41 | 10.2 | 70 |
Product Dimensions
The table below outlines the available sizes of our fine polishing pads, including both circular and square options to meet your specific application needs.
| Round Dimensions (mm) | Square Dimensions (mm) |
| 590 | 960 | 1000*1000 |
| 640 | 1050 | 1200*1200 |
| 820 | 1180 | ... |
| Thickness Range (mm) |
| 0.80-1.50 |
Choose Alfa Chemistry
With extensive expertise in precision polishing materials, Alfa Chemistry is committed to delivering reliable and high-performance solutions for advanced manufacturing industries, particularly in semiconductor processing. Our fine polishing pads are developed under strict quality control standards to ensure consistent structure, stable performance, and low defectivity across batches. If you are interested in our products, please feel free to contact us.
