Lithium tantalate is renowned for its exceptional piezoelectric properties, making it a preferred material for surface acoustic wave (SAW) devices. SAW grade lithium tantalate (LiTaO3) wafers are a specialized type of single-crystal wafer meticulously developed for the creation of SAW devices. These devices play a pivotal role in modern electronics, finding extensive applications in telecommunications, sensing, and navigation systems. The manufacturing process of SAW grade lithium tantalate wafers involves careful growth and precise processing to achieve the desired crystallographic orientation and surface quality. This rigorous control makes the wafers exhibit a high electromechanical coupling coefficient, a critical parameter that determines their effectiveness in converting energy between mechanical and electrical states. Additionally, these wafers possess a low temperature coefficient of delay, which means their performance remains stable across a broad range of temperatures. These characteristics are particularly important for applications that demand high-frequency operation and consistent performance in varying environmental conditions (including extreme temperatures), and make SAW grade lithium tantalate wafers an indispensable component in the fabrication of SAW devices used in critical applications.
Alfa Chemistry's high precision SAW grade lithium tantalate wafers are manufactured to meet the stringent requirements of advanced electronic applications. These wafers are available in a variety of orientations such as X-cut, Y-cut and Z-cut, each offering unique properties suitable for specific SAW device configurations. More importantly, our precision wafers are characterized by low defect rates and optimal surface quality, ensuring superior device performance.
SAW Grade Lithium Tantalate Wafers | ||
Catalog | SC-TFW007 | |
Curie Temp | 603±2 ℃ | |
Cutting Angle | X, Y, Z, X112Y, Y36, Y42, Y48, etc. | |
Diameter/Size | 2"/3"/4"/6" | |
Tolerance (±) | <0.20 mm | |
Thickness | 0.1-1 mm or more | |
Primary Flat | 22 mm /32 mm /42.5 mm /57.5 mm or as customized | |
Orientation Flat | All available | |
Surface Type | Single side polished /Double sides polished | |
Polished Side Ra | <0.5 nm | |
Back Side Criteria | Generally 0.2-0.5 µm or as customized | |
Edge Criteria | R=0.2mm or Bullnose | |
Wafer Surface Criteria | Contamination | None |
Particles Φ>0.3 μm | ≤30 | |
Scratch, Chipping | None | |
Defect | No edge cracks, scratches, saw marks, stains |
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