Semiconductor integrated circuits are the core components of electronic products and are critical to the quality control of electronic devices such as diodes, resistors, and printed circuit boards (PCBs). In order to support the development of SiC and other next-generation power devices, Alfa Chemistry has conducted research on wafer analysis, chip structure, and module microstructure, and proposed corresponding solutions.
We investigate and analyze the causes of failures of LSI products, individual electronic components, and electronic parts to help improve quality control and increase customer product development efficiency and increase product yield. Using our rich research experience as a backing, we can satisfy customers' problem-solving needs through effective investigations and quick responses.
Alfa Chemistry evaluates the defects of the SiC wafer and epitaxial layer through impurity analysis, and conducts microstructure analysis of the device.
Wafer/Epitaxial layer (impurities/stress/defects)
Analysis of Installed Components
|Environmental tests||Thermal shock test||Electromigration test|
|Low-temperature storage test||Pressure cooker test|
|Constant temperature and humidity test||Electrostatic discharge (ESD) resistance test|
|Nondestructive tests||Ultrasonic flaw detection||X-ray analysis microscope measurement|
|Transmission X-ray observation||Liquid crystal method to identify short-circuit location|
|Soldered joints tests||Peel strength test||Wettability test|
|Bonding wire tensile shear test||Durability test|
|Reflow soldering heat resistance test|
|Electrical characteristics evaluation||VI characteristics||Interlayer resistance measurement|
|Volume resistivity measurement|
|Test preprocessing for analysis||Diced||Precision polishing|
|FIB method||Wire saw cutting|
|LSI layering||Package dismantling|
Over the years, Alfa Chemistry has provided services to a wide range of industries, including:
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