Surface Structuring

Alfa Chemistry has the experience and equipment necessary to both prototype and mass produce sub-micron surfaces at industry leading prices. Our expert staff uses 30 years of manufacturing experience and the most advanced equipment to provide various surface structuring services.

As a full-service organization, we provide all aspects from concept to production, including design consulting. Various services can help you complete the entire project. In addition to our standard test mode, we also provide custom services based on end user designs.

Alfa Chemistry's Technologies

Our surface structuring technology can be divided into nano-structuring and micro-structuring. In nanostructures, with the help of multiple technologies, structures with lateral dimensions in the nanometer range (<1 µm) can be created in various layers (such as Si, SiO₂ or Al). Both technologies can use various technologies and standard equipment. 

• Technology Nodes: 65 nm, 90 nm, 130 nm, 180 nm, 250 nm and larger
• Lithography Tools: Immersion, scanner, stepper, proximity/contact aligner, e-beam
• Photoresist: 193 nm, 248 nm (DUV), I-Line, KrF and ArF
• Etch: Wet, RIE, DRIE, Lift off
• Metrology: Mask / reticle manufacture, SEM, cross section, e-test, etc.

About Nano Structuring

ENAS uses nanoimprint lithography (NIL) to create nanostructures and produces high-resolution wafers through electron beam exposure. The positive imprint of the master can be printed into the nano-thick photoresist layer by copying, and the photoresist layer is cured by ultraviolet rays. Finally, these nanostructures can be transferred to various materials by dry etching.

Structurable Materials

• Metals: Al
• Insulators: SiO₂
• Semiconductors: Si
• Polymers: UV-photoresist
• Other materials upon request

Substrates

• Wafer
• Substrates up to 300 mm size
• Other round substrates (e.g. steel, ceramics, silicon, glass)

About Micro Structuring

In microstructuring, a polymer or polymer layer can be constructed in the micrometer range by photolithography and imprinting methods. These structures can be transferred to various materials by wet chemistry and dry etching.

Structurable Materials

• Imprinting
• Photolithography
• Positive and negative resists
• UV: Ormocere, photoresists
• Thermal: PMMA, MMA, photoresists
• Dry etching

Metals: Al, Ta, Cu
Semiconductors: Ge, Si
Insulators: SiO2, SiN, TaN ,TiN

• Wet etching

Metals: Pd, Sn, Pt, Ni, Al, Au, Cu
Semiconductors: Si
Insulators: SiO2, SiN, TiN, TaN

• Other materials upon request

Substrates

• Wafer
• Substrates up to 300 mm size
• Other round substrates (e.g. steel, ceramics, silicon, glass)

Reference

1. Kim J, et al (2020). “Fiber Lithography: A Facile Lithography Platform Based on Electromagnetic Phase Modulation Using a Highly Birefringent Electrospun Fiber.” ACS Applied Materials & Interfaces. 12(17): 20056-20066