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The thickness of the wafer is an important indicator of component availability. Wafers are used in the production of integrated circuits and as substrates for microelectronic equipment. Various types of wafers have various applications, and for each application, a specific wafer diameter needs to be followed. Alfa Chemistry provides customers with accurate wafer thickness testing services to meet customer application requirements. The test items can accurately measure the thickness uniformity and tolerance of each wafer. You can rest assured of our test report.

Alfa Chemistry Measurement Methods

Measurement Methods Alfa Chemistry uses capacitive sensing technology to measure wafer thickness. The wafer is located between the two probes. The distance between the probes is accurately known, and the gap between the wafer and the probes is derived from the capacitance at each measurement point.

Alfa Chemistry uses a non-contact capacitive scanner to measure the thickness and shape of rotating wafers. Compared with laser interference, capacitive sensing technology has low cost, but good stability, high precision and resolution.

Our Thickness Analysis Platforms

Thickness Alfa Chemistry has high-precision and advanced testing instruments, which can provide accurate test results. Our testing instruments include, but are not limited to, the following:

  • MTI INSTRUMENTS Proforma 300SA
  • FIBERPRO TM5300-6

Detectable Samples Include:

  • Semi-insulating and semi-conductive wafer materials.
  • Adapt to 150mm, 200mm and 300mm wafer diameters.
  • Can be used for almost all materials, including germanium wafers, silicon wafers, sapphire, gallium arsenide wafers (GaAs) and indium phosphide wafers.

If you want to test other types of samples, please contact us for consultation.

Testing Standard

  • ASTM F533-2002 Standard Test Method for Thickness and Thickness Change of Silicon Wafer
  • ASTM F523-2002 Standard Practice for Unaided Visual Inspection of Polished Silicon Wafer Surfaces
  • ASTM F1530-1994 Standard Test Method for Measuring Flatness, Thickness and Thickness Change of Silicon Wafer by Automatic Non-contact Scanning Method
  • ASTM F928-2002 Standard Test Methods for Edge Contour of Circular Semiconductor Wafers and Rigid Disk Substrates
  • ASTM F533-1996 Standard Test Method for Thickness and Thickness Change of Silicon Wafer
  • JIS H0611-1994 Silicon Wafer Thickness, Thickness Change and Bending Measurement Method
  • KS D 0259-2012 Method for Measuring The Thickness, Thickness Change and Curvature of Silicon Wafers

Why Us?

  • Alfa Chemistry laboratory adopts international laboratory management system.
  • Alfa Chemistry has a high-level, professional and experienced technical team.
  • Alfa Chemistry's detection period is short and we have complete experimental programs.

Our products and services are for research use only and cannot be used for any clinical purpose.

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