Alfa Chemistry provides a comprehensive portfolio of chemical mechanical polishing (CMP) materials, including high-performance cerium oxide polishing powders designed for precision polishing applications. Developed through optimized particle engineering and strict quality control, our cerium oxide polishing powders deliver reliable polishing efficiency, superior surface finishing capability, and excellent process stability for a variety of semiconductor and advanced material substrates.
Cerium oxide polishing powder is widely used in precision polishing applications because of its high polishing efficiency, excellent surface finish, and low defect generation. Alfa Chemistry offers a comprehensive portfolio of CMP materials, including high-performance cerium oxide polishing powders for advanced precision polishing applications. Developed through optimized particle engineering and strict quality control, our products provide stable polishing performance, efficient material removal, and excellent surface quality for a wide range of semiconductor and advanced material substrates.
Product Features
The main features of our product are as follows:
01
- Excellent Suspension Stability
The polishing powder maintains good dispersion stability during processing. This helps ensure uniform slurry performance and reduces particle sedimentation.
02
It provides strong and efficient material removal capability during polishing. This contributes to improved processing efficiency and shorter polishing time.
03
The powder is designed to reduce particle-induced surface damage. It helps achieve smoother surfaces with fewer scratches and defects.
04
- Uniform Particle Distribution
The product features a narrow and controlled particle size distribution. Uniform particles help deliver more stable and consistent polishing results.
05
The particles maintain stable polishing performance over extended use. This helps reduce material consumption and improve overall cost efficiency.
Product Specifications
Alfa Chemistry offers cerium oxide polishing powders in various specifications to meet different polishing requirements.
| Catalog Number | Color | Median Particle Size (um) | Application Areas |
| ACSEM-CMP-0001 | White | 0.4-0.5 | Photomask fine polishing, precision optics |
| ACSEM-CMP-0002 | White | 0.4-0.6 | Glass spheres, precision optics |
| ACSEM-CMP-0003 | White | 0.6-0.8 | Precision Optics, optical fibers |
| ACSEM-CMP-0004 | White | 0.7-1.0 | Glass wafers, photomasks, and optical fibers |
| ACSEM-CMP-0005 | White | 1.2-1.3 | Blue glass rough polishing |
| ACSEM-CMP-0006 | White | 1.0-1.3 | Precision optical glass |
| ACSEM-CMP-0007 | White | 1.1-1.2 | Precision optical glass |
| ACSEM-CMP-0008 | White | 1.2-1.3 | Precision optical glass |
| ACSEM-CMP-0009 | White | 1.3-1.5 | Float glass and ultra-clear glass |
| ACSEM-CMP-0010 | White | 1.8-2.0 | Precision optical glass |
| ACSEM-CMP-0011 | White | 1.8-2.3 | Quartz, K9, BK7, and other optical glasses |
| ACSEM-CMP-0012 | White | 2.8-3.0 | Float glass, quartz, and K9 glass |
| ACSEM-CMP-0013 | Red | 0.6-0.8 | FK and laf precision optical glass |
| ACSEM-CMP-0014 | Red | 0.8-1.1 | Wafers and optical glass |
| ACSEM-CMP-0015 | Red | 1.1-1.4 | Prisms (polyprisms, microprisms) |
| ACSEM-CMP-0016 | Red | 1.3-1.6 | Crystal oscillators, ZF series optical glass |
Choose Alfa Chemistry
With extensive experience in CMP materials, Alfa Chemistry is committed to providing high-performance solutions for modern precision manufacturing needs. Our cerium oxide polishing powders are developed under strict quality control standards to ensure stable particle characteristics, reliable polishing performance, and consistent surface quality.
In addition to comprehensive product support, we also offer customized particle size solutions and professional technical assistance to help customers optimize polishing efficiency, reduce defects, and improve overall process reliability. If you are interested in our products or would like to discuss your specific application requirements, please feel free to contact us at any time for further information and technical support.
