
Silica polishing slurry is a precision polishing material commonly used in semiconductor manufacturing, optical processing, precision ceramics, and other advanced material industries. It is mainly applied in fine polishing and final finishing processes to improve surface smoothness, flatness, and overall surface quality of various substrates and components.
At Alfa Chemistry, we provide high-performance silica polishing slurry formulated with high-purity silica micropowders and carefully optimized dispersion systems. Designed for precision finishing processes, our product effectively minimizes scratches and surface defects while delivering superior flatness and mirror-like surface quality. With stable chemical properties and long service life, it is an ideal choice for advanced polishing applications requiring both efficiency and precision.
The main features of our product are as follows:
Our silica polishing slurry is manufactured through precisely controlled particle processing technology to ensure a narrow particle size distribution and highly spherical particle morphology. The uniformity of abrasive particles helps maintain consistent polishing behavior across the entire workpiece surface, reducing the risk of localized defects and improving process repeatability.
Through optimized formulation design and stable chemical balance, the slurry provides efficient material removal while maintaining excellent surface integrity. The stable pH system helps ensure consistent polishing performance throughout extended processing cycles.
The slurry is engineered to support ultra-flat surface processing requirements. It can achieve excellent surface quality with surface roughness values as low as Ra < 0.2 nm and total thickness variation (TTV) below 3 μm, meeting the demanding standards of the semiconductor industry.
Featuring excellent dispersion stability and slow crystallization characteristics, the slurry maintains reliable polishing performance over long operating periods. Its extended usable lifetime helps reduce slurry consumption and improve overall process efficiency.
To satisfy different polishing requirements and processing conditions, Alfa Chemistry offers silica polishing slurry in various particle sizes and pH ranges, enabling customers to select suitable formulations for specific surface finishing applications. Typical product specifications are listed below:
| Catalog Number | Median Particle Size (nm) | PH | Application Areas |
| ACSEM-CMP-0078 | 20-40 | 10.0 | Single-crystal silicon, silicon carbide, gallium arsenide, laser crystals, and other compound semiconductors |
| ACSEM-CMP-0079 | 40-60 | 10.0 | Silicon dioxide films, lithium niobate, and lithium tantalate |
| ACSEM-CMP-0080 | 60-80 | 10.0 | Sapphire substrates, laser crystals, optical crystals, lithium niobate, and lithium tantalate |
| ACSEM-CMP-0081 | 60-80 | 3.0 | Aluminum nitride ceramics |
| ACSEM-CMP-0082 | 80-120 | 10.5 | Laser crystals, precision metals, aluminum alloys, and alumina ceramics |
Alfa Chemistry is committed to providing reliable silica polishing slurry solutions that help customers achieve stable polishing performance and superior surface quality in precision manufacturing applications. To meet the requirements of different materials and processing conditions, we offer flexible customization options, including adjustable particle sizes and pH ranges. All products are manufactured under strict quality control standards to ensure excellent consistency, long service life, and dependable batch-to-batch performance.
Supported by experienced technical teams and responsive customer service, Alfa Chemistry works closely with customers to optimize polishing processes, improve production efficiency, and deliver high-quality finishing results for semiconductor and other advanced material applications. If you are interested in our products, please contact us immediately.
If you do not find the product or would like to request a quote, please contact us.