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Alumina Polishing Powder

As a trusted provider of high-performance chemical mechanical polishing (CMP) materials, Alfa Chemistry offers a comprehensive portfolio tailored to the evolving needs of the semiconductor industry. Among these solutions, alumina polishing powder stands out as a robust and versatile abrasive engineered for precision planarization across a wide range of substrates.

Our alumina polishing powder is carefully engineered with well-controlled particle sizes and optimized surface properties. During the polishing process, the clustered particles naturally break apart into smaller fragments. This continuous renewal creates fresh cutting edges, allowing the material to maintain stable polishing performance over time. Our product is widely applicable to a range of semiconductor substrates, including silicon, germanium, gallium arsenide, indium phosphide, and lithium tantalate.

Product Features

Alfa Chemistry's alumina polishing powder is designed to deliver both performance and reliability across diverse CMP applications. The main features of our product are as follows:

01
  • High Purity for Contamination Control

The powder is manufactured with stringent purity standards to minimize metallic and ionic impurities. This helps reduce contamination risks during polishing, which is critical for maintaining the electrical performance of semiconductor devices.

02
  • Enhanced Cutting Efficiency

The aggregated alumina particles are designed to continuously break into smaller sharp edges during polishing. This self-renewing effect helps maintain strong cutting performance throughout the process, enabling faster material removal while still achieving smooth and high-quality surfaces.

03
  • Uniform Particle Size Distribution

A tightly controlled particle size distribution ensures consistent polishing behavior across the wafer surface. This uniformity is essential for achieving excellent planarity and minimizing defects such as scratches or dishing.

04
  • Optimized Surface Finish

While offering high removal rates, the polishing powder is also engineered to achieve controlled surface roughness, enabling a balance between efficiency and surface smoothness tailored to specific application needs.

Product Specifications

Our alumina polishing powder is available in multiple grades to accommodate diverse CMP requirements. Particle size ranges can be customized from coarse to ultra-fine distributions, with narrow size distribution profiles to ensure predictable performance.

Catalog NumberGrit SizeMedian Particle Size (um)Catalog NumberGrit SizeMedian Particle Size (um)
ACSEM-CMP-0017#24058.6±3.0ACSEM-CMP-0028#15008.40±0.60
ACSEM-CMP-0018#28049.4±3.0ACSEM-CMP-0029#20006.90±0.50
ACSEM-CMP-0019#32041.4±2.5ACSEM-CMP-0030#25005.60±0.50
ACSEM-CMP-0020#36036.1±2.0ACSEM-CMP-0031#30004.00±0.50
ACSEM-CMP-0021#40030.9±2.0ACSEM-CMP-0032#40003.00±0.40
ACSEM-CMP-0022#50026.4±2.0ACSEM-CMP-0033#60002.00±0.40
ACSEM-CMP-0023#60021.1±1.5ACSEM-CMP-0034#80001.20±0.30
ACSEM-CMP-0024#70017.9±1.3ACSEM-CMP-0035#90000.71~0.90
ACSEM-CMP-0025#80014.7±1.3ACSEM-CMP-0036#100000.51~0.70
ACSEM-CMP-0026#100011.9±1.0ACSEM-CMP-0037#200000.50※(2)
ACSEM-CMP-0027#12009.90±0.80ACSEM-CMP-0038#300000.32※(1.3)

Choose Alfa Chemistry

With over two decades of industry experience, Alfa Chemistry combines deep technical expertise with a strong commitment to innovation in semiconductor materials. We provide not only high-quality alumina polishing powders but also end-to-end support, including formulation guidance, process optimization, and customization services. Our solutions are designed to help clients achieve higher efficiency, improved surface quality, and reduced manufacturing costs.

By partnering with Alfa Chemistry, customers gain access to reliable materials, responsive technical support, and tailored solutions designed to optimize polishing efficiency, surface quality, and process stability. If you have any requirements, please feel free to contact us.

Our products and services are for research use only and cannot be used for any clinical purpose.

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