Silicon carbide (SiC) is a crystalline compound composed of silicon and carbon atoms. SiC has the advantages of low thermal expansion, high corrosion resistance, excellent hardness and high thermal conductivity. The inherent properties of SiC make it an important material in the applications of microelectronics and microelectromechanical systems (MEMS). Alfa Chemistry has many years of experience in developing and optimizing SiC films. We can adjust the deposition conditions to provide various SiC films and ideal film stress levels for many MEMS specific applications.
Alfa Chemistry uses physical vapor deposition (PVD) and plasma enhanced chemical vapor deposition (PECVD) to deposit Silicon Carbide (SiC) films.
In a high-temperature vacuum or in a gaseous plasma, the powdered silicon carbide is converted into vapor while performing SiC PVD. After all the materials have been evaporated, they are moved to a partial or full vacuum furnace containing wafers. Once in the furnace, the steam is deposited on the surface of the substrate, forming a thin layer of emery.
Our vapor-deposited silicon carbide is superior to any silicon carbide available today. The outstanding properties of Alfa Chemistry's SiC films include excellent chemical resistance and excellent thermal properties.
CVD SiC is often used in RTP and oxide etching chamber components due to the excellent thermal shock resistance of SiC and its resistance to erosion by high-energy plasma. The heating element and base made of low-resistance SiC can improve the uniformity of heating inside the processing chamber. Other ways it may be beneficial to the industry include chambers or linings with improved in-situ cleaning uniformity, sputtering targets, and all types of electrodes. At the same time, CVD silicon carbide can improve space utilization in crowded processing tools. In addition, our low-resistance silicon carbide film is very suitable for susceptors, processing chambers, heaters, electrostatic chucks or any application that requires electrical conductivity, abrasion resistance and thermal shock resistance.
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