Wafer Processing

Thank you for considering Alfa Chemistry's wafer processing service!

Alfa Chemistry provides customized solutions for the needs of wafer annealing, ion implantation, dicing and polishing/recycling. For more than 20 years, we have been providing customers with high-quality, reliable and value-for-money wafer processing services, as well as unparalleled technical support.

• We offer low-cost, rapid prototyping of small scale semiconductor wafer processing services for researchers, universities and companies.
• We have a wide selection of original and test-grade silicon wafers, ranging from 1 inch to 12 inches in diameter to meet your needs.
• The services can also be carried out according to the materials provided by the customer.

We are dynamic and flexible to our customer's requirements and take the time to really understand your needs to provide exactly what is specified. Contact us now to discuss your wafer processing requirements.

Alfa Chemistry's Wafer Processing Services are as Follows:

AnnealingSurface StructuringLaser MarkingResizing / CoringDicingWafer ThinningWafer BondingEpitaxial WaferPolishing & ReclaimImplant

• Annealing: We supply nitrogen and forming gas annealing services which can achieve temperatures up to 1100 ℃.
• Implant: We offer wafer implant services for silicon, SOI, and other types of specialty substrates such as GaN, SiC, and more.
• Dicing: We can successfully assist our customers in reclaiming their wafers for further use.
• Polishing & Reclaim: We can supply high-quality polishing results across different materials.
• Epitaxial Wafer Service: We can provide single, dual, and triple layer epitaxial solutions that can be done on silicon, SOI and SOS wafers.
• Laser Marking: We are perfect for those looking for a quick-turn service for marking pre-existing wafers or die.
• Wafer Thinning: We offer quick and reliable service for backside or front side thinning of various types of substrates and materials.
• Wafer Bonding: We offer the service for temporary or permanent silicon wafer bonding.
• Wafer Resizing/Coring: We are coring (resizing) wafers, substrates, and laser machining silicon devices such as sensors, detectors, and solar cells.
• Surface Structuring: Alfa Chemistry's surface structuring technology can create structures with lateral dimensions in the nanometer range in various layers.

Alfa Chemistry Selects the Best Instruments to Characterize Wafers

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