Sinter Silver/Copper Paste

To address key challenges in power module manufacturing—such as substrate warpage, poor thermal dissipation, and the demanding requirements of high-power operation—Alfa Chemistry has developed advanced sinterable silver and copper pastes designed specifically for third-generation semiconductors and power device packaging interconnections. These materials are engineered for robust bonding between chips and substrates, as well as between substrates and heat sinks, enabling stable mechanical and electrical performance even under harsh operating conditions. Featuring low-temperature sintering, high strength, and low cost, Alfa Chemistry's sinter silver and copper pastes offer an ideal solution for improving thermal management, enhancing long-term reliability, and supporting the efficient, high-density integration required in modern power electronics.

Our Products

Alfa Chemistry provides sinter silver and copper pastes to meet customer requirements. The specifications of our products are as follows:

Product Advantages

• This product exhibits excellent printability and low-temperature sintering performance.
• The product is manufactured using an integrated powder-paste preparation technology, resulting in low cost.
• The sintered layer exhibits high densification and excellent electrical conductivity.
• The product features low impurity residue.
• The product provides good storage stability and consistent batch-to-batch performance.
• The product is free of hazardous substances such as lead and cadmium, and complies with RoHS regulations.

You Need to Know

• Storage conditions: 2–8 °C, sealed and protected from light.
• Shelf life: 3 months.
• Safety instructions: This product contains volatile organic solvents. Keep it away from open flames and heat sources to prevent any impact on product performance.