Silver paste for LTCC (low temperature co-fired ceramic) is a conductive material formulated to deliver excellent printability, high electrical conductivity, and strong adhesion during multilayer circuit fabrication. Designed to withstand LTCC co-firing temperatures, it ensures stable sintering, forming dense and uniform silver networks within the ceramic layers. This paste enables precise conductor patterns with smooth edges and consistent thickness, supporting reliable signal transmission and long-term device stability in applications such as RF modules, sensors, antennas, and embedded passive components.
Alfa Chemistry offers a range of high-quality silver pastes for LTCC applications. These products feature excellent co-firing compatibility and electrical performance, providing highly reliable solutions for LTCC packaging systems.
| Catalog Number | ACSEM-EP-0014 | ACSEM-EP-0015 | ACSEM-EP-0016 | ACSEM-EP-0017 |
| Viscosity | 1300-1800 Pa·S | 300-600 Pa·S | 1000-1200 Pa·S | 500-700 Pa·S |
| Fineness | ≤10 μm | ≤10 μm | ≤10 μm | ≤8 μm |
| Solid Content | 90 ± 1% | 85 ± 1% | 77 ± 2% | 80 ± 1% |
| Silver Content | 92 ± 1% | 88 ± 1% | 80 ± 2% | 83 ± 1% |
| Application | Via fill | Outer electrode | Ground electrode | Inner electrode |
| Appearance | Silver-gray paste | Silver-gray paste | Silver-gray paste | Silver-gray paste |
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