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Tungsten Boride Sputtering Target

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Catalog Number
ACM12007102-1
CAS
12007-10-2
Purity99.5%
ApplicationTungsten boride sputtering targets are primarily used for depositing ultra-hard films. They possess high hardness and excellent thermal stability, making them commonly applied to substrates such as silicon, stainless steel, and Inconel.
CompositionW2B

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Micro and Nanoelectronics
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