Description | TSPO1 is an electon transfer layer (ETL) or hole blocking layer (HBL) in OLED devices. |
IUPAC Name | (4-diphenylphosphorylphenyl)-triphenylsilane |
Molecular Weight | 536.67 |
Molecular Formula | C36H29OPSi |
Canonical SMILES | C1=CC=C(C=C1)[Si](C2=CC=CC=C2)(C3=CC=CC=C3)C4=CC=C(C=C4)P(=O)(C5=CC=CC=C5)C6=CC=CC=C6 |
InChI | InChI=1S/C36H29OPSi/c37-38(30-16-6-1-7-17-30,31-18-8-2-9-19-31)32-26-28-36(29-27-32)39(33-20-10-3-11-21-33,34-22-12-4-13-23-34)35-24-14-5-15-25-35/h1-29H |
InChI Key | TXBFHHYSJNVGBX-UHFFFAOYSA-N |
Boiling Point | 236 °C |
Melting Point | 661.0 ± 51.0 °C |
Purity | 95%+ |
Appearance | Solid |
Application | TSPO1 is a phosphine oxide-based blocking and host material with triplet energy excitons. It is mainly used in the formation of a blocking layer that enhances the performance of organic electronic devices like organic light-emitting diodes (OLEDs), and delayed fluorescent devices. |
Storage | room temp |
Form | solid |
Quality Level | 100 |