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| Purity | 99.9% |
|---|---|
| Application | Tantalum-aluminum sputtering targets are primarily used in the semiconductor chip manufacturing field, playing a crucial role particularly in the wafer fabrication and chip packaging stages. The high melting point, excellent corrosion resistance, and high strength characteristics of tantalum-aluminum sputtering targets provide outstanding thermal stability in high-temperature environments, making them suitable for electronic components and semiconductor devices. They effectively enhance the electrical performance and reliability of the devices. |
| Composition | Ta/Al |