Copper-Nickel Sputtering Target

Catalog Number

ACMA00062458

Purity	99.99%
Application	Copper-nickel sputtering targets are an alloy material formed by fusing copper and nickel in a specific ratio, offering excellent mechanical properties, electrical conductivity, and corrosion resistance. These targets are primarily used for sputtering deposition of thin films and are widely applied in fields such as semiconductor integrated circuits (VLSI), optical discs, and flat panel displays. Additionally, copper-nickel alloy targets exhibit good weldability and medium to high strength, making them broadly applicable across various industries.
Composition	Cu/Ni

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