Aluminum-Silicon-Copper Sputtering Target

Purity	99.9-99.9999%
Application	Aluminum-Silicon-Copper (AlSiCu) sputtering targets are widely used in the semiconductor industry, particularly as metallization layers in integrated circuits and microelectronic devices. The addition of silicon and copper to aluminum enhances the alloy's mechanical strength, resistance to electromigration, and thermal stability, all of which are essential for the durability and reliability of interconnects and contacts in electronic components. AlSiCu films are typically deposited using physical vapor deposition (PVD) techniques like sputtering and are patterned through photolithography and etching processes, making them crucial in the fabrication of high-performance microelectronic and optoelectronic devices.
Composition	Al/Si/Cu