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| Purity | 99.9-99.995% |
|---|---|
| Application | Tungsten-Titanium (WTi) sputtering targets are widely used in semiconductor and solar cell manufacturing due to their critical role as diffusion barriers and adhesive agents. In microchip production, WTi is employed to separate metallization layers, such as aluminum or copper, from the silicon semiconductor. This prevents the formation of intermetallic phases that could degrade the semiconductor's performance. Additionally, in flexible thin-film solar cells (CIGS), a WTi barrier layer is used to block iron atoms from diffusing from the steel substrate into the CIGS semiconductor, as even trace amounts of iron can drastically reduce the cell's efficiency. The unique properties of WTi make it indispensable for enhancing both the performance and reliability of advanced electronic and solar technologies. |
| Composition | W/Ti |