Electrical Analysis

At Alfa Chemistry, we have also studied the impact of package interconnections on the overall system-level signal integrity and power integrity. When it comes to high-speed digital, radio frequency (RF), or mixed-signal integrated circuits (IC), our customers are looking for the best package performance to complement the robustness of their chip design in the actual system environment.

Alfa Chemistry provides a series of electrical characterization services and support throughout the design process. Our global package characterization team provides support to design centers around the world.

Our Mission

Alfa Chemistry uses first-class high-end 3D field solvers to predict and optimize the broadband electrical performance of high-speed package designs to help customers obtain the best package performance.

This type of package performance data is then used in system-level models that are solved in the time and/or frequency domain to gain a deeper understanding of the impact of packaging on system performance.

High Speed Electrical Design

Alfa Chemistry uses arrays or simulation tools to model the most complex packaging design layouts with the required level of structural accuracy. Combined with these complete 3D electromagnetic field solvers and high-frequency simulators, we can accurately solve these structures.

Subsequently, we can generate multi-port S-parameter behavior models from DC to tens of GHz in the frequency domain. These models can accurately display the output of key networks in a given substrate layout.

Signal Integrity and Power Integrity

System-level performance indicators, as well as voltage sags and bounces on the power transmission path, are key indicators of the acceptability of the package design. It is very important to verify that the electrical performance of the package remains within the tolerances allowed by the system noise and timing budget.

• We use Ansoft Designer and Keysight ADS to perform end-to-end system simulations in the time and/or frequency domain, which can include device models from customers and circuit/behavior models for interconnection.
• Timing and noise data output from this type of simulation enables you to quickly make smart packaging design trade-offs throughout the packaging development cycle.

Electrical Characterization Report

• List all digital interfaces and analog circuits.
• Paste the oscilloscope screenshot of each measurement.
• List the measurements that must be taken to check the specifications.
• List all relevant specifications for each interface/circuit; obtain specifications from the component data sheet.
• Include a summary of each interface/circuit, list the measured values next to the specified value, and declare each pass or fail.