Molding compound is a key element of IC packaging, so the impact on IC reliability is very obvious. Mold flow analysis is the use of computer-aided analysis technology (CAE) to study the flow of plastics in injection molds, analyze and predict product and mold design defects.
To ensure the reliability of IC packaging, Alfa Chemistry provides low-cost and professional mold flow analysis services, including void prediction, wire sweeping and warpage simulation. This service can help customers shorten product development time, and discover potential product problems in advance to achieve the purpose of improving product quality and reducing costs.
Our experienced engineers have more than 10 years of experience in mold design and analysis and can solve your most difficult engineering problems. Tools such as AutoCAD Moldflow and Moldex3D are used to predict the following physics.
Traditional mechanical simulation usually only considers the material properties and temperature drift and does not consider the detailed chemical kinetics of the molding compound in the manufacturing step.
Alfa Chemistry's R&D team considers online processing parameters, especially the manufacturing and processing of molded composite materials to form IC packages on strips. In order to accurately predict the warpage, online manufacturing parameters such as pressure, temperature, shrinkage, and processing time must be carefully considered.
The prediction of wire deformation during molding compound flow is critical to package design and IC reliability. When the packaging structure, the packaging direction on the substrate strip, and the molding compound processing factor are optimized, the line scanning rate may be greatly reduced.
The characterization team of Alfa Chemistry focuses on predicting the generation of voids before manufacturing. Our gap prediction covers three different processes:
Early finite element analysis (FEM) numerical simulations can not only predict the risk of voids but also provide the best economic method without trial and error in the packaging development process. The filling, packaging, and curing of the molding compound are considered to ensure the best IC reliability.
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