Thermal Analysis

With the rapid development of electronic products, IC packaging has become more and more lightweight, thinner, and shorter, but its heating density continues to increase. The issue of heat dissipation is increasingly important. How to reduce the package thermal resistance to improve the heat dissipation efficiency is a very important technology in package design.

Due to different structures, the heat dissipation effects and design methods of various packaging forms are also different. Alfa Chemistry combines the development trends to provide you with a thermal simulation service.

We perform thermal performance simulations based on conditions provided by the customers to predict the junction temperature and thermal resistance of integrated circuit (IC) packages. Our thermal simulation analysis can optimize the thermal performance of IC packages to meet various customer requirements or specifications.

Thermal Performance Simulation

When the IC is energized, it generates heat, so thermal management should be considered when choosing packaging to ensure high product reliability. In order to keep the junction temperature of the device below the maximum allowable value, effective heat flow from the IC through the package to the environment is critical. Alfa Chemistry provides services to simulate the thermal resistance of IC packages.

• Thermal resistance measures the ability of the package to transfer the heat generated by the chip to the circuit board or the environment.
• By calculating the temperature at two points, the heat flow from one point to another is determined by the thermal resistance.
• By understanding the thermal resistance of the package, the junction temperature of the IC can be calculated for given power consumption and its reference temperature.

Optimization Of Materials And IC Configuration

In addition to providing professional thermal analysis and testing services, Alfa Chemistry can also optimize the materials and configurations of IC packaging to meet special heat dissipation requirements. Our R&D engineers will work closely with you to optimize key thermal factors to improve thermal performance.