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The mission of Alfa Chemistry is to use the synergy between design and analysis, and we will do this with unlimited enthusiasm! We provide customers with better products, faster time to market, and with reduced risks. For more than 10 years, we have provided professional integrated circuit mechanical analysis services to global customers. Alfa Chemistry's mechanical analysis service includes warpage simulation, stress simulation, and solder joint life prediction using ANSYS and ABAQUS tools.
As a leader in the semiconductor industry, Alfa Chemistry can offer a range of expertise to:
Warpage and stress are the main considerations for the reliability of integrated circuits (ICs). The thermo-mechanical coupling of materials that occurs during the standard manufacturing process will affect the reliability of the IC package.
Alfa Chemistry's mechanical simulation analysis service considers the impact of material properties, manufacturing processes and assembly procedures on ICs.
The design and characterization team of Alfa Chemistry has a broad background in the analysis of solder joint reliability analysis, such as life prediction for temperature cycle testing and package configuration optimization to meet application specifications. Various constitutive equations and life prediction models are used to correlate simulation data and experimental data.
Alfa Chemistry has the ability to solve complex mechanical analysis related challenges.
We cooperate with customers from well-known corporations. We have in-depth product development knowledge, practical experimental testing skill, and software tool expertise, you can get the following benefits:
If you do not find the product or would like to request a quote, please contact us.