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Tungsten Boride Sputtering Target

Catalog Number
ACM12007099-2
CAS
12007-09-9
Purity99.5%
ApplicationTungsten boride sputtering targets are primarily used for depositing ultra-hard films. They exhibit high hardness and excellent thermal stability, making them commonly applied to substrates such as silicon, stainless steel, and Inconel.
CompositionWB

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