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| Description | The structure of tantalum is body centered cubic (BCC) metal. It is a refractory metal; stable up to very high temperatures. Tantalum is ductile at room temperature and moderately ductile at cryogenic temperatures. Compton profile of highly pure thin elemental foil of tantalum was investigated using IGP type coaxial photon detector.1 |
|---|---|
| IUPAC Name | tantalum; |
| Molecular Weight | 180.95 |
| Molecular Formula | Ta; |
| Canonical SMILES | [Ta] |
| InChI | 1S/Ta,GUVRBAGPIYLISA-UHFFFAOYSA-N |
| InChI Key | GUVRBAGPIYLISA-UHFFFAOYSA-N |
| Boiling Point | 5425 °C (lit.) |
| Melting Point | 2996 °C (lit.) |
| Density | 16.69 g/cm3 (lit.) |
| Solubility | Insoluble (NIOSH, 2016);Soluble in fused alkalies; insoluble in acids except hydrofluoric and fuming sulfuric acids;Insoluble in water.;Solubility in water: none;Insoluble; |
| Application | Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition. |
| Storage | room temp |
| Assay | 99.95% trace metals basis |
| Autoignition Temperature | 572 °F |
| Dimension | 2.00 in. × 0.25 in. |
| EC Number | 231-135-5 |
| Form | foil |
| MDL Number | MFCD00011252 |
| Packaging | 1 ea in rigid mailer |
| Quality Level | 100 |
| Resistivity | 13.5 μΩ-cm, 20°C |
| Vapor Pressure | <0.01 mmHg ( 537.2 °C) |
