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| Description | Product benefits:• Very high electrical conductivity.• Very low curing temperature for printing on flexible substrates.• Non CMR ink.• Unchanged conductivity on bending.• Compatible with various curing processes including photonic, IR, low vacuum oven and thermal.• Good adhesion on various flexible substrates |
|---|---|
| Molecular Formula | Ag |
| Storage | 2-8°C |
| Form | viscous liquid (paste) |
| Quality Level | 100 |
