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Silver-Copper Sputtering Target

Catalog Number
ACM11144437-4
CAS
11144-43-7
Purity99.99%
ApplicationSilver-Copper Sputtering Targets are crucial in advanced technology applications, particularly in semiconductor manufacturing, Chemical Vapor Deposition (CVD), and Physical Vapor Deposition (PVD). These targets are used to deposit thin films of ultra-high purity silver-copper alloys onto substrates, a process vital for producing high-performance electronic components, optical devices, and displays. The high purity (up to 99.999%) and refined grain structures of these targets ensure uniform film deposition, which is essential for the functionality and reliability of semiconductors, solar cells, fuel cells, and flip-chip applications. Moreover, the versatility in target configurations allows for their use in both legacy and state-of-the-art sputtering equipment, supporting a wide range of research and commercial applications in cutting-edge industries.
CompositionAg/Cu

Our products and services are for research use only and cannot be used for any clinical purpose.

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