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Copper

Copper
Catalog
ACM7440508-9
CAS
7440-50-8
Synonyms
CHEBI:28694; Copper, rod, 200mm, diameter 2.0mm, as drawn, 99.99+%; Copper, wire reel, 5m, diameter 0.75mm, as drawn, 99.98+%; Copper, rod, 200mm, diameter 9.5mm, hard, 99.9%; Copper, foil, thickness 0.25 mm, length 2 m, purity 99.9%; Copper, foil, thickness 0.15 mm, size 100 x 100 mm, purity 99.9%; Copper powder, 5% in graphite; Copper - O.F.H.C., foil, 5m coil, thickness 0.1mm, hard, 99.95+%; Copper granulated; Copper, foil, thickness 0.038 mm, length 2 m, purity 99.9%;
Descriptioninsulated wire, 0.1m, conductor diameter 0.1mm, insulation thickness 0.01mm, PTFE (polytetrafluoroethylene) insulation, 99.99%
IUPAC Namecopper
Molecular Weight63.55
Molecular FormulaCu
Canonical SMILES[Cu]
InChI1S/Cu,RYGMFSIKBFXOCR-UHFFFAOYSA-N
InChI KeyRYGMFSIKBFXOCR-UHFFFAOYSA-N
Boiling Point4703 °F at 760 mm Hg (NIOSH, 2016)
Melting Point1083.4 °C (lit.)
Density8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94
SolubilityInsoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble
ApplicationSputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Storage2-8°C
Assay99.95% trace metals basis
EC Number231-159-6
Formwire
MDL NumberMFCD00010965
Packaging1 ea in rigid mailer
Quality Level100
Vapor Pressure0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)

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