Description | insulated wire, 0.1m, conductor diameter 0.1mm, insulation thickness 0.01mm, PTFE (polytetrafluoroethylene) insulation, 99.99% |
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IUPAC Name | copper |
Molecular Weight | 63.55 |
Molecular Formula | Cu |
Canonical SMILES | [Cu] |
InChI | 1S/Cu,RYGMFSIKBFXOCR-UHFFFAOYSA-N |
InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
Boiling Point | 4703 °F at 760 mm Hg (NIOSH, 2016) |
Melting Point | 1083.4 °C (lit.) |
Density | 8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94 |
Solubility | Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble |
Application | Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition. |
Storage | 2-8°C |
Assay | 99.95% trace metals basis |
EC Number | 231-159-6 |
Form | wire |
MDL Number | MFCD00010965 |
Packaging | 1 ea in rigid mailer |
Quality Level | 100 |
Vapor Pressure | 0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx) |