Aluminum-Copper Sputtering Target

Purity	99.9-99.9999%
Application	Aluminum-Copper (Al/Cu) Sputtering Targets are essential in various advanced technological applications, particularly in the semiconductor industry and electronics manufacturing. These targets are used in the sputtering process to deposit thin films of aluminum-copper alloys onto substrates, a critical step in the fabrication of microelectronic devices. The addition of copper to aluminum enhances the electrical conductivity and adhesion properties of the thin films, making them ideal for interconnects in integrated circuits, printed circuit boards (PCBs), and other electronic components. The high purity and uniformity of Al/Cu sputtering targets ensure consistent film quality, which is crucial for the reliability and performance of semiconductor devices. Additionally, these targets are used in the production of reflective coatings, corrosion-resistant layers, and other functional coatings in various high-tech applications. Their versatility and superior material properties make Aluminum-Copper Sputtering Targets a preferred choice in industries demanding precision and high-performance thin films.
Composition	Al/Cu